As artificial intelligence and high-performance computing (HPC) drive unprecedented computational demands, data centers must evolve to support higher densities and greater thermal loads. Coolnet’s liquid cooling solutions deliver the next level of efficiency and reliability for today’s most demanding workloads.
Engineered for Extreme Performance
Purpose-built for high-density compute environments, Coolnet’s advanced liquid cooling systems—featuring both cold plate and immersion technologies—provide breakthrough thermal management for AI, machine learning, and HPC applications.
- Supports up to 100kW per rack, ensuring scalability for even the most intensive deployments.
- Achieves industry-leading PUE as low as 1.15, dramatically lowering operational costs and environmental impact.
Superior Efficiency & Heat Management
Our liquid cooling solutions deliver:
- Up to 40% better heat transfer efficiency compared to traditional air-cooling systems.
- 50-65% reduction in cooling energy consumption, significantly cutting your OPEX and carbon footprint.
- Waste heat reuse capability, with outlet water temperatures reaching up to 70°C, enabling new opportunities for sustainability and energy recycling.
Optimized for the Future of Computing
Coolnet’s liquid cooling systems bring unmatched reliability, energy efficiency, and scalability to high-density compute clusters. Whether powering next-gen AI or supporting mission-critical HPC workloads, our solutions set a new standard for performance and sustainability.
Experience breakthrough cooling for high-density compute clusters—choose Coolnet for industry-leading efficiency and innovation.
